Honors
Honors and awards
- 2025
- Amazon Research Award
- NSF POSE Award
- NVIDIA Academic Grant
- IEEE 2025 Micro Top Picks Honorable Mention
- 2023
- 2022
- 2022 ACM SIGMOD China Doctoral Dissertation Award
- WAIC 2022 Yunfan Award · Tomorrow Stars
- Best Scalable Data Science Paper Award of VLDB 2022
- Outstanding Graduate of Beijing, China
- Outstanding Graduate of Peking University
- 2021
- 2021 Synced Machine Intelligence TOP-10 Open Source Awards (Hetu)
- Pop SOTA！List for AI Developers 2021 (Hetu)
- Outstanding Award & Champion of 2021 CCF BDCI Contest
- President Scholarship of Peking University
- Academic Innovation Award of Peking University
- Merit Student Award of Peking University
- 2020
- Lee Wai Wing Scholarship of Peking University
- 2019
- Mininglamp Technology Scholarship of Peking University
- 2018
- Miaozhen Scholarship of Peking University
- 2015
- ACM-ICPC Asia Regional Contest, Changchun Site, Silver Medal
- ACM-ICPC Asia Regional Contest, Beijing Site, Silver Medal
Professional Services
- Organzing Committee: MLSys 2026 Artifact Evaluation Co-Chair, MLSys 2025 Artifact Evaluation Co-Chair, KDD 2025 Artifact Badging Co-Chair
- Program Committee or Conference Reviewer: ASPLOS (2027, 2026), VLDB (2026, 2024 Demo), PLDI (2026), MLSys (2026, 2025, 2023), ICLR (2026, 2025), NeurIPS (2025, 2024), ICML (2025, 2024), ICDE (2026, 2025, 2024), WWW (2025), CVPR (2023), AAAI (2024, 2023, 2021), KDD (2023, 2019), IJCAI (2023), DASFAA (2025, 2024, 2023, 2022), EuroMLSys@EuroSys (2026, 2025, 2024, 2023), MLBench@ASPLOS (2025), PAKDD (2024, 2023), SDM (2024), ADMA (2023), DCAA@AAAI (2023)
- Artifact Evaluation Committee: OSDI 2023, SIGMOD 2023, ATC 2023
- Journal Reviewer: VLDBJ, CSUR, TOIS, TKDE, TPDS, TDSC, FGCS, PARCO